o Experience in Advanced package development in CSP, BGA, WLCSP, Fan-out, SiP; familiarity with Flip Chip, Wafer-level Packaging and 3D/ TSV technologies;
o Expereince with package mech design, reliability testing, qualification and failure modes/failure analysis.
o Experience with package manufacturing technology i.e. FMEA, DFM, Yield management
Paste your resume here or
Attach resume file